Bhubaneswar: The establishment of an advanced semiconductor glass core packaging substrate manufacturing facility in Odisha is the result of a highly synchronized, multi-layered effort combining union-level policy driving, state-level execution, and existing strategic corporate footholds.
The Government of Odisha recently signed a tripartite Memorandum of Understanding with global tech leader Intel Corporation and US-based 3D Glass Solutions to explore this opportunity, positioning the state as an emerging destination for next-generation technology manufacturing.
This milestone materialized thanks to the sincere efforts of Shri Vishal Kumar Dev, Additional Chief Secretary of Electronics and Information Technology and Energy, whose leadership was instrumental in bringing Intel to Odisha.
A fundamental anchor for the agreement was the pre-existing footprint of 3D Glass Solutions, which had already secured clearance under the India Semiconductor Mission to establish an advanced semiconductor packaging unit at Info Valley in Khurda. Because Intel Capital maintains a core investment position within 3D Glass Solutions, the global technology giant organically expanded its partnership to integrate proprietary technology and licensing, scaling the Odisha initiative into a major industrial venture.
At the national level, the project received significant momentum through the Union Ministry of Electronics and Information Technology. The India Semiconductor Mission actively prioritized advanced semiconductor packaging to integrate the domestic tech ecosystem into global supply chains. Union officials worked to align federal fiscal incentive frameworks with the state’s logistical capabilities, ensuring international corporate executives viewed the region as a viable manufacturing hub.
On the ground, the administrative machinery worked with ACS Shri Dev in command alongside state leadership led by Chief Minister Shri Mohan Charan Majhi and Union Minister Shri Ashwini Vaishnaw to provide the executive speed and policy certainty required to close the deal.
The state’s industrial sectors utilized single-window clearance mechanisms to assure land, reliable power infrastructure, and administrative support at Info Valley.
This coordinated push successfully convinced global technology leaders, including Intel Foundry executives, that the Bhubaneswar-Khurda corridor possessed the necessary talent pool, infrastructure, and policy stability to support the next era of high-performance computing and artificial intelligence hardware manufacturing.