New Delhi: Odisha is rapidly positioning itself as a central pillar of India’s digital and technology landscape. At SEMICON India 2026, Chief Minister Mohan Charan Majhi engaged directly with global chipmakers and technology leaders, including 3D Glass Solutions, SiCSem, Applied Materials, and Lam Research.
The high-profile state delegation included Electronics and Information Technology Minister Dr. Mukesh Mahaling, Chief Secretary Anu Garg, and Additional Chief Secretary for Energy and E&IT Shri Vishal Dev, who coordinated the state’s showcase.
Together, they presented Odisha’s technological capabilities, proactive governance, and readiness to host high-end semiconductor manufacturing and design enterprises.
Union Minister for Electronics and Information Technology Shri Ashwini Vaishnaw has played a crucial role in enabling this technological momentum. Under his guidance, the Union Government has directed substantial central fiscal support toward Odisha’s semiconductor initiatives.
Minister Shri Vaishnaw highlighted that the state possesses ideal conditions, such as reliable power, water infrastructure, and a skilled workforce, enabling Odisha to lead complex technology value chains. Central and state authorities are collaborating on a mega 871-acre manufacturing park near Bhubaneswar dedicated specifically to IT, semiconductors, and electronics.
The state’s semiconductor push is already yielding ground-level results across manufacturing, research, and infrastructure. India’s first advanced 3D glass substrate semiconductor packaging project by 3D Glass Solutions is being established in Odisha with an investment of nearly 2,000 crore rupees, backed by both central and state fiscal support.
Additionally, SiCSem Pvt Ltd has secured approval for a 3,006 crore rupee integrated silicon carbide semiconductor facility at Infovalley-II in Khurda under the India Semiconductor Mission. Furthering this progress, Intel, 3DGS, and the Government of Odisha signed an agreement to advance glass core substrate manufacturing technologies in the Bhubaneswar-Khurda corridor.
Academic institutions are also contributing directly to the national pool, with NIT Rourkela designing indigenous integrated circuits, including encryption cores and sensor circuits under MeitY’s Chip-to-Startup program. Through synchronized central backing, visionary policy design, and aggressive industry outreach, Odisha has transitioned from a resource-rich state into a fast-growing global center for high-tech electronics and semiconductor infrastructure.