New Delhi: The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, has approved four new semiconductor projects under the India Semiconductor Mission (ISM) with a cumulative investment of around ₹4,600 crore.
These projects, located in Odisha, Punjab, and Andhra Pradesh, will boost India’s semiconductor manufacturing capabilities, bringing the total number of approved projects under the ISM to 10 across six states with total investments of approximately ₹1.60 lakh crore. The new initiatives are expected to create 2,034 skilled jobs directly.
Projects in Odisha
SiCSem Private Limited is partnering with Clas-SiC Wafer Fab Ltd., UK, to establish India’s first commercial compound semiconductor fabrication facility in Info Valley, Bhubaneswar. This plant will produce Silicon Carbide (SiC) devices with an annual capacity of 60,000 wafers and a packaging capacity of 96 million units. These products are crucial for applications in defense, electric vehicles, railways, and renewable energy systems.
3D Glass Solutions Inc. (3DGS) will also set up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneswar. This facility will introduce advanced packaging technology, including glass interposers and 3D Heterogeneous Integration (3DHI) modules. The unit will have a capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually, with applications in defense, high-performance computing, artificial intelligence, and automotive sectors.
The Union Government noted that these projects will significantly strengthen the country’s semiconductor ecosystem and complement the growing chip design capabilities being developed across India.